Conductive Microspheres

Product Introduction:
Conductive microspheres are usually prepared by applying a metal coating to monodisperse polymer microspheres. These microspheres are commonly used as conductive fillers in adhesives, coatings and films to provide electrical conductivity. They can also be used in electromagnetic interference (EMI) shielding, as well as in sensors and other electronic components.

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Our Products

Conductive Au Microspheres: Conductive Au (gold) microspheres are tiny spherical particles coated with gold, a highly conductive and corrosion-resistant metal. These microspheres have advantages such as uniform particle size, high conductivity, suitable elasticity, and strong adhesion between the gold shell and the resin core. They are specifically designed for connections between fine-pitch electrodes, such as vertical conduction between the two glass panels of liquid crystal display (LCD) cells. In addition, they are often dispersed in binders for the preparation of anisotropic conductive films (ACF) or anisotropic conductive pastes (ACP).

Conductive Ni Microspheres: Conductive Ni (nickel) microspheres are small spherical particles coated with nickel, known for its good electrical conductivity, magnetic properties, and relatively low cost. These microspheres are often used in applications requiring magnetic properties and conductivity, such as in EMI shielding, inductors, and magnetic sensors. They are also utilized in conductive adhesives, coatings, and various electronic components, where they contribute to improved electrical performance and durability.

Our conductive Au microspheres and conductive Ni microspheres have a wide range of application prospects as they help to improve the overall performance and reliability of electronic devices. If you have any needs, please feel free to contact us.

Product Name	Catalog Number	Particle Size	Increment	CV	K at 10% Deformation*	Metal Thickness	Metal Content
Conductive Au Microspheres	NM-MSPs026	7.00-11.00 µm	0.25 µm	≤3.5%	~450 kgf/mm²	100-150 nm	30-55%
	NM-MSPs027	3.00-6.75 µm	0.25 µm	≤3.5%	~500 kgf/mm²	100-150 nm	50-80%
	NM-MSPs028	7.00-11.00 µm	0.25 µm	≤3.5%	~250 kgf/mm²	100-150 nm	30-55%
	NM-MSPs029	3.00-6.75 µm	0.25 µm	≤3.5%	~300 kgf/mm²	100-150 nm	50-80%
Conductive Ni Microspheres	NM-MSPs030	7.00-11.00 µm	0.25 µm	≤3.5%	~450 kgf/mm²	100-150 nm	30-55%
Conductive Ni Microspheres	NM-MSPs031	3.00-6.75 µm	0.25 µm	≤3.5%	~500 kgf/mm²	100-150 nm	50-80%

* The K value at 10% deformation is defined by the following equation:
K=(3/√2)∙F∙S-^3/2∙R^-1/2
wherein F and S represent a load value (kgf) and a compression displacement (mm) at 10% compression deformation of the particle, respectively, and R represents a radius (mm) of the particle.

Basic Performance Parameters

Product Name	Conductive Au Microspheres	Conductive Ni Microspheres
Density	~1.7 g/cm³	~1.7 g/cm³
Coefficient of Thermal Expansion	5-7×10-5/°C (core); 1.3-1.4×10^-5/°C (metal)	5-7×10-5/°C (core); 1.3-1.4×10^-5/°C (metal)
Volume Conductance	<1×10^-2 Ω·cm	<3×10^-2 Ω·cm

Product Characteristics

Wide range of particle size options: 3.0-11.0 µm (in 0.25 µm increment)
Uniform particle size with a coefficient of variation (CV) less than 3.5%
Good dispersibility, with no overlapping or agglomeration
Suitable hardness for high conduction reliability
Low resistance, high stability under high temperature and high humidity conditions