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  • Tungsten
  • Tungsten

    Catalog Number
    ACM7440337-33
    Chemical Name
    Tungsten
    CAS
    7440-33-7
    Category
    Other Nanoparticles
    Description
    insulated wire, 10m, conductor diameter 0.075mm, insulation thickness 0.02mm, PTFE (polytetrafluoroethylene) insulation, 99.9%
    Structure
    Synonyms
    W
    IUPAC Name
    tungsten
    Molecular Weight
    183.84
    Molecular Formula
    W
    Canonical SMILES
    [W]
    InChI
    1S/W,WFKWXMTUELFFGS-UHFFFAOYSA-N
    InChIKey
    WFKWXMTUELFFGS-UHFFFAOYSA-N
    Boiling Point
    10701 °F at 760 mm Hg (NIOSH, 2016)
    Melting Point
    3410 °C (lit.)
    Purity
    > 99.99%
    Density
    19.3 (NIOSH, 2016);18.7-19.3 @ 20 °C/4 °C; depends on extent of working.;19.3 g/cm3;19.3
    Solubility
    Insoluble (NIOSH, 2016);Sol in mixture of nitric acid and hydrofluoric acid;Solubility in water: none;Insoluble
    Application
    Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
    Storage
    room temp
    APS
    25 nm
    Color Form
    Steel-gray to tin-white metal; body centered cubic structure;CRYSTALLINE FORM GRAY-BLACK, CUBIC;Hard, brittle, steel-gray to tin-white solid.
    Diameter
    #REF!
    EC Number
    231-143-9
    Electrical Resistivity
    4.9 μΩ-cm, 20°C
    Exact Mass
    183.950933g/mol
    Form
    wire
    Heat Of Vaporization
    1150 cal/g
    Length
    2 m
    MDL Number
    MFCD00011461
    Monoisotopic Mass
    183.950933g/mol
    RTECS Number
    YO7175000
    Stability
    STABLE IN DRY AIR @ ORDINARY TEMP;OXIDIZES IN AIR & MUST BE PROTECTED @ ELEVATED TEMP
    Thickness
    0.02 mm
    Vapor Pressure
    0 mm Hg (approx) (NIOSH, 2016);1.97X10-7 mm Hg @ 2,327 °C;0 mmHg (approx)
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