Catalog Number
ACM7440508-2
Chemical Name
Copper Nanorods
Description
Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid.
Synonyms
Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
InChIKey
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Purity
99%, 99.9%, 99.99%, 99.999%
Solubility
Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble
Color Form
Reddish, lustrous, ductile, malleable metal;Red metal; cubic
Electrical Resistivity
1.673 μΩ-cm @ 20°C
Electronegativity
1.90 Paulings
GHS Pictogram
GHS02 Flame GHS07 Exclamation Point
Hazard Statements
H228-H400
Heat Of Fusion
13.26 kJ·mol-1
Heat Of Vaporization
300.4 kJ·mol-1
Monoisotopic Mass
62.929597g/mol
Odor
Odorless /Copper dusts and mists/
Specific Heat
0.39 kJ/kg K
Stability
BECOMES DULL WHEN EXPOSED TO AIR. IN MOIST AIR GRADUALLY BECOMES COATED WITH GREEN BASIC CARBONATE.
Thermal Conductivity
401 W·m-1·K-1
Thermal Expansion
(25 °C) 16.5 µm·m-1·K-1
Vapor Pressure
0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx)
Young S Modulus
110-128 GPa